OVERVIEW

Official designation: GE Fanuc IC694MDL753 (PACSystems RX3i, Discrete Output Module)

Role/Application: High-density 32-point discrete output module providing 12/24 VDC positive logic switching for industrial loads, organized into four electrically isolated groups of eight outputs each.

KEY SPECS SUMMARY

Power: 260 mA maximum from 5 VDC bus

Interfaces / Ports: Fujitsu-style connector

Indicators: 32 individual status LEDs

Operating Temp: 0 degrees C to 60 degrees C

Platform / Compatibility: PACSystems RX3i Universal Backplane

Limit: 0.5 Amps per point, 4 Amps maximum per group

Lifecycle: Active or Discontinued, varies by model/revision

FREQUENTLY ASKED QUESTIONS

Technical Specifications:

Q: What is the maximum allowed leakage current when the output is in the off-state?

A: The maximum off-state leakage current specification for the outputs is 0.1 mA.

Wiring & Installation:

Q: What is the recommended current limit for a single common pin on the I/O connector?

A: Maximum current handling for a single group common pin is 3 Amps.

Troubleshooting & Compatibility:

Q: What is the maximum response time for turning the outputs on and off?

A: Both the on-state and off-state response times are a maximum of 0.5 milliseconds.

Replacement & Upgrades:

Q: Does this module support hot swap capability in a running RX3i system?

A: Yes, the IC694MDL753 module is designed to support hot swap capability.