OVERVIEW

Official designation: GE Fanuc IC695CHS012 (PACSystems RX3i, 12-Slot Universal Backplane)

Role/Application: Provides the structural and electrical backbone for the RX3i system, supporting up to 12 modules, and enabling high-speed communication via dual PCI and Serial bus architectures.

KEY SPECS SUMMARY

Power: 600 mA at 3.3 VDC, 240 mA at 5 VDC

Interfaces / Ports: TB1 terminal block, 12 slots

Indicators: N/A

Operating Temp: 0 to 60 degrees C

Platform / Compatibility: PACSystems RX3i, IC695/4/3 modules

Limit: 102 mm (4 inches) clearance on all sides

Lifecycle: Active, or Discontinued by Manufacturer (varies by revision)

FREQUENTLY ASKED QUESTIONS

Technical Specifications:

Q: What wire gauge is recommended for connecting the optional external 24 VDC power source to TB1?

A: The backplane terminal strip accepts individual wires ranging from 14 AWG to 22 AWG.

Wiring & Installation:

Q: Does the IC695CHS012 backplane support hot swap capability for modules?

A: Yes, this universal backplane is engineered to support module hot swap functionality to reduce system downtime.

Troubleshooting & Compatibility:

Q: Which GE Fanuc module series are compatible with the RX3i dual-bus backplane?

A: The dual-bus architecture supports IC695 PCI-based modules and IC694/IC693 serial I/O modules.

Replacement & Upgrades:

Q: Is there an installation restriction for the IC695CHS012 backplane based on its orientation?

A: The backplane is designed for horizontal mounting and requires NEMA/UL Type 1 (IP20) protection.